Vista normal Vista MARC Vista ISBD

Advanced MEMS packaging / Advanced microelectromechanical systems packaging John H. Lau ... [et al.] - xxiii, 552 p. : ill. ; 24 cm.

Includes bibliographical references and index.

Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices.

ISBN: 9780071626231 (alk. paper) 0071626239 (alk. paper)

LCCN: 2009040456

Subjects--Topical Terms:
Microelectromechanical systems.
Microelectronic packaging.

Dewey Class. No.: 621.381046