Reliability of RoHS-Compliant 2D and 3D IC interconnects / John Lau.

Includes bibliographical references and index.

Machine generated contents note: Brief TOCCh 1. Introduction to RoHS Compliant Semiconductor and Packaging TechnologiesCh 2. Reliability Engineering of Lead-Free InterconnectsCh 3. Notes on Failure CriterionCh 4. Reliability of 1657-Pin CCGA Lead-Free Solder JointsCh 5. Reliability of PBGA (w/o Underfils) Lead-Free Solder JointsCh 6. Reliability of LED Lead-Free InterconnectsCh 7. Reliability of VCSEL Lead-Free InterconnectsCh 8. Reliability of Low-Temperature Lead-Free (SnBiAg) Solder JointsCh 9. Reliability of Lead-Free (SACX) Solder JointsCh 10. Chip-to-Wafer (C2W) Lead-Free Interconnect ReliabilityCh 11. Wafer-to-Wafer (W2W) Lead-Free Interconnect ReliabilityCh 12. Through-Silicon-Via (TSV) Interposer Lead-Free Interconnect ReliabilityCh 13. Electromigration of Lead-Free Microbumps for 3D IC IntegrationsCh 14. Effects of Dwell-Time and Ramp-Rates on SAC Thermal Cycling Test ResultsCh 15. Effects of High Strain Rate (Impact) on SAC Solder BumpsCh 16. Effects of Voids on Solder Joints Reliability.

"Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integration Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive details on RoHS-compliant electronics packaging solder interconnects. This authoritative guide aids in developing innovative, high-performance, cost-effective, and reliable lead-free interconnects for electronics and optoelectronic products. Reliability of RoHS-Compliant 2D and 3D IC Interconnects Covers chip-level interconnect reliability, first- and second-level interconnect reliability, and 3D IC integration interconnect reliability Addresses challenging problems created by increasing interest in lead-free interconnect reliability of 3D packaging and 3D IC integration Provides information fundamental to research and development of design (mechanical, optical, electrical, and thermal); materials; process; manufacturing; testing; and reliability for lead-free interconnects in RoHS-compliant electronics products Removes road blocks to, avoids unnecessary false starts in, and accelerates design, materials, and process development in packaging technology In-depth details: Introduction to RoHS Compliant Semiconductor and Packaging Technologies; Reliability Engineering of Lead-Free Interconnects; Notes on Failure Criterion; Reliability of 1657-Pin CCGA Lead-Free Solder Joints; Reliability of PBGA Lead-Free Solder Joints; Reliability of LED Lead-Free Interconnects; Reliability of VCSEL Lead-Free Interconnects; Reliability of Low-Temperature Lead-Free (SnBiAg) Solder Joints; Reliability of Lead-Free (SACX) Solder Joints; Chip-to-Wafer (C2W) Lead-Free Interconnect Reliability; Wafer-to-Wafer (W2W) Lead-Free Interconnect Reliability; Through-Silicon-Via (TSV) Interposer Lead-Free Interconnect Reliability; Electromigration of Lead-Free Microbumps for 3D IC Integrations; Effects of Dwell-Time and Ramp-Rates on SAC Thermal Cycling Test Results; Effects of High Strain Rate (Impact) on SAC Solder Bumps; Effects of Voids on Solder Joints Reliability"--

"Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive coverage of RoHS-compliant electronics packaging solder interconnects. RoHS--the restriction of the use of certain hazardous substances in electrical and electronic equipment--is law in the EU, China, Japan, Korea, Canada, Australia, California, etc. RoHS bans lead and five other materials; thus, in order to ship electrical products to these regions and countries, products must be lead-free. The material in this book aids in developing innovative, high-performance, cost-effective, and reliable lead-free interconnects for electronics and optoelectronic products"--