Harman, George G.
Wire bonding in microelectronics /
George G. Harmon
- 3rd ed.
- 1 online resource (xx, 426 p.) : illustrations (some color)
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
9780071476232
2010287045
Encapsulado electrónico--Confiabilidad
Encapsulado electrónico--Defectos
Semiconductores--Defectos
621.3815 / 23