TY  - BOOK
AU  - Harman, George G.
TI  - Wire bonding in microelectronics
SN  - 9780071476232
U1  - 621.3815 
PY  - 2010///
CY  - New York
PB  - McGraw-Hill
KW  - Encapsulado electrónico
KW  - Confiabilidad
KW  - Defectos
KW  - Semiconductores
N1  - Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989
UR  - https://www.accessengineeringlibrary.com/content/book/9780071476232
ER  -