Microvias : for low-cost, high-density interconnects /
John H. Lau, S.W. Ricky Lee.
- New York : McGraw-Hill, c2001.
- 1 online resource (xxiii, 565 pages) : illustrations
The first-ever book on microvias, the new high-density interconnect technology changing the nature of printed circuit boards–and driving the mobile electronic revolution. A must for electronics and mechanical engineers, this intensive introduction covers microvia technology expertly surveys all major techniques: mechanical NC drilling, laser drilling, photo-defined, chemical etching, and conductive ink formation. Features a detailed survey of the work of leading companies–and their products–from around the globe.
9780071363273
Microelectronic packaging. Integrated circuits--Design and construction--Cost control. Semiconductors--Junctions. Printed circuits.