TY  - BOOK
AU  - Lau, John H.
AU  - Lee, S. W. Ricky.
TI  - Microvias: for low-cost, high-density interconnects 
SN  - 9780071363273
U1  - 621.381046 21
PY  - 2001///
CY  - New York
PB  - McGraw-Hill
KW  - Microelectronic packaging
KW  - Integrated circuits
KW  - Design and construction
KW  - Cost control
KW  - Semiconductors
KW  - Junctions
KW  - Printed circuits
N2  - The first-ever book on microvias, the new high-density interconnect technology changing the nature of printed circuit boards–and driving the mobile electronic revolution. A must for electronics and mechanical engineers, this intensive introduction covers microvia technology expertly surveys all major techniques: mechanical NC drilling, laser drilling, photo-defined, chemical etching, and conductive ink formation. Features a detailed survey of the work of leading companies–and their products–from around the globe
UR  - http://www.loc.gov/catdir/bios/mh041/2001030752.html
UR  - http://www.loc.gov/catdir/toc/mh031/2001030752.html
UR  - http://www.loc.gov/catdir/description/mh031/2001030752.html
UR  - https://www.accessengineeringlibrary.com/content/book/9780071363273
ER  -