TY  - BOOK
AU  - Lau,John H.
TI  - Advanced MEMS packaging
SN  - 9780071626231 (alk. paper)
U1  - 621.381046 22
PY  - 2010///
CY  - New York
PB  - McGraw-Hill
KW  - Microelectromechanical systems
KW  - Microelectronic packaging
N1  - Includes bibliographical references and index; Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices
UR  - https://www.accessengineeringlibrary.com/content/book/9780071626231
ER  -