Lau, John H. <br/><br/>
Through-silicon Vias for 3d Integration / 
John H. Lau. 
 - 1 online resource (xxiv, 487 pages) :  illustrations (some color) 
<br/><br/>Includes bibliographical references and index. 
<br/><br/> This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products. 
<br/><br/><label>ISBN: </label>9780071785143 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Circuitos integrados tridimensionales
<br/><br/><label>Dewey Class. No.: </label>621.3815