TY  - BOOK
AU  - Lau, John H.
TI  - Through-silicon Vias for 3d Integration
SN  - 9780071785143
U1  - 621.3815 
PY  - 2013///]
CY  - New York
PB  - McGraw-Hill
KW  - Circuitos integrados tridimensionales
KW  - ARMARC 2.0
N1  - Includes bibliographical references and index
N2  - This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products
UR  - https://www.accessengineeringlibrary.com/content/book/9780071785143
UR  - https://www.loc.gov/catdir/enhancements/fy1614/2015510566-b.html
UR  - https://www.loc.gov/catdir/enhancements/fy1614/2015510566-d.html
UR  - https://www.loc.gov/catdir/enhancements/fy1614/2015510566-t.html
ER  -