| 000 | 01083pam a2200313 a 4500 | ||
|---|---|---|---|
| 001 | 16196039 | ||
| 005 | 20231006121307.0 | ||
| 007 | cr |||||aaa | ||
| 008 | 100420s2010 nyua gob 001 0 eng | ||
| 010 | _a 2010287045 | ||
| 020 | _a9780071476232 | ||
| 040 |
_aDLC _cEC-QuPUC _dDLC _bspa _epn _fPamela Vega |
||
| 041 | _aenm | ||
| 082 |
_a621.3815 _b23 |
||
| 100 |
_aHarman, George G. _982995 |
||
| 245 | 1 | 0 |
_aWire bonding in microelectronics / _cGeorge G. Harmon |
| 250 | _a3rd ed. | ||
| 264 | 1 |
_aNew York : _bMcGraw-Hill, _c2010 |
|
| 300 |
_a1 online resource (xx, 426 p.) : _billustrations (some color) |
||
| 336 | _atxt | ||
| 337 | _ac | ||
| 338 | _acr | ||
| 500 | _aRev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989. | ||
| 650 | 0 |
_aEncapsulado electrónico _xConfiabilidad _983000 |
|
| 650 | 0 |
_aEncapsulado electrónico _xDefectos _983000 |
|
| 650 | 7 |
_aSemiconductores _xDefectos _963816 |
|
| 856 | _uhttps://www.accessengineeringlibrary.com/content/book/9780071476232 | ||
| 942 | _cEBK | ||
| 999 |
_c286036 _d286034 |
||