000 | 01083pam a2200313 a 4500 | ||
---|---|---|---|
001 | 16196039 | ||
005 | 20231006121307.0 | ||
007 | cr |||||aaa | ||
008 | 100420s2010 nyua gob 001 0 eng | ||
010 | _a 2010287045 | ||
020 | _a9780071476232 | ||
040 |
_aDLC _cEC-QuPUC _dDLC _bspa _epn _fPamela Vega |
||
041 | _aenm | ||
082 |
_a621.3815 _b23 |
||
100 |
_aHarman, George G. _982995 |
||
245 | 1 | 0 |
_aWire bonding in microelectronics / _cGeorge G. Harmon |
250 | _a3rd ed. | ||
264 | 1 |
_aNew York : _bMcGraw-Hill, _c2010 |
|
300 |
_a1 online resource (xx, 426 p.) : _billustrations (some color) |
||
336 | _atxt | ||
337 | _ac | ||
338 | _acr | ||
500 | _aRev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989. | ||
650 | 0 |
_aEncapsulado electrónico _xConfiabilidad _983000 |
|
650 | 0 |
_aEncapsulado electrónico _xDefectos _983000 |
|
650 | 7 |
_aSemiconductores _xDefectos _963816 |
|
856 | _uhttps://www.accessengineeringlibrary.com/content/book/9780071476232 | ||
942 | _cEBK | ||
999 |
_c286036 _d286034 |