000			01848cam a22003494a 4500
001			12352717
005			20231011092322.0
007			ca aa aaaaa
008			010320s2001 nyua o 000 0 eng
020			_a9780071363273
040			_aDLC _cEC-QuPUC _bspa _erda _fLuis Sotalín
041			_aenm
082	0	0	_a621.381046 _221
100			_aLau, John H. _983153 _eaut
245	1	0	_aMicrovias : _bfor low-cost, high-density interconnects / _cJohn H. Lau, S.W. Ricky Lee.
260			_aNew York : _bMcGraw-Hill, _cc2001.
300			_a1 online resource (xxiii, 565 pages) : _billustrations
336			_atxt
337			_ac
338			_acr
520			_aThe first-ever book on microvias, the new high-density interconnect technology changing the nature of printed circuit boards–and driving the mobile electronic revolution. A must for electronics and mechanical engineers, this intensive introduction covers microvia technology expertly surveys all major techniques: mechanical NC drilling, laser drilling, photo-defined, chemical etching, and conductive ink formation. Features a detailed survey of the work of leading companies–and their products–from around the globe.
650		0	_aMicroelectronic packaging.
650		0	_aIntegrated circuits _xDesign and construction _xCost control.
650		0	_aSemiconductors _xJunctions.
650		0	_aPrinted circuits.
700			_aLee, S. W. Ricky. _983158
856	4	2	_3Contributor biographical information _uhttp://www.loc.gov/catdir/bios/mh041/2001030752.html
856	4	1	_3Table of contents _uhttp://www.loc.gov/catdir/toc/mh031/2001030752.html
856	4	2	_3Publisher description _uhttp://www.loc.gov/catdir/description/mh031/2001030752.html
856	4	2	_uhttps://www.accessengineeringlibrary.com/content/book/9780071363273
942			_cEBK
999			_c286275 _d286273