000			01464cam a2200325 a 4500
001			15956240
005			20231003084603.0
008			091022s2010 nyua b 001 0 eng
010			_a 2009040456
020			_a9780071626231 (alk. paper)
020			_a0071626239 (alk. paper)
035			_a(OCoLC)ocn277205716
040			_aDLC _cEC-QuPUC _dDLC _bspa _erda _fPamela Vega
041			_aenm
082	0	0	_a621.381046 _222
245	0	0	_aAdvanced MEMS packaging / _cJohn H. Lau ... [et al.]
246	3		_aAdvanced microelectromechanical systems packaging
264		1	_aNew York : _bMcGraw-Hill, _c2010.
300			_axxiii, 552 p. : _bill. ; _c24 cm.
336			_atxt
337			_an
338			_anc
504			_aIncludes bibliographical references and index.
505	0		_aEnabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices.
650		0	_aMicroelectromechanical systems.
650		0	_aMicroelectronic packaging.
700	1		_aLau, John H.
856			_uhttps://www.accessengineeringlibrary.com/content/book/9780071626231
942			_cEBK
999			_c286294 _d286292