| 000 | 01453cam a2200313 i 4500 | ||
|---|---|---|---|
| 001 | 18996962 | ||
| 005 | 20231023124428.0 | ||
| 007 | cr az aaaaa | ||
| 008 | 160301s2013 nyua gob 001 0 eng c | ||
| 020 | _a9780071785143 | ||
| 040 |
_aBTCTA _beng _cEC-QuPUC _erda _fCarmen GuachamÃn |
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| 041 | _aenm | ||
| 082 | _a621.3815 | ||
| 100 |
_aLau, John H. _983153 _eorg |
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| 245 | 1 | 0 |
_aThrough-silicon Vias for 3d Integration / _cJohn H. Lau. |
| 264 | 1 |
_aNew York : _bMcGraw-Hill, _c[2013] |
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| 300 |
_a1 online resource (xxiv, 487 pages) : _billustrations (some color) |
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| 336 |
_btxt _atxt |
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| 337 |
_bn _ac |
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| 338 |
_bnc _acr |
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| 504 | _aIncludes bibliographical references and index. | ||
| 520 | 8 | _aThis professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products. | |
| 650 | 7 |
_aCircuitos integrados tridimensionales _2ARMARC 2.0 _962772 |
|
| 856 | 4 | 2 | _uhttps://www.accessengineeringlibrary.com/content/book/9780071785143 |
| 856 | 4 | 2 |
_3Contributor biographical information _uhttps://www.loc.gov/catdir/enhancements/fy1614/2015510566-b.html |
| 856 | 4 | 2 |
_3Publisher description _uhttps://www.loc.gov/catdir/enhancements/fy1614/2015510566-d.html |
| 856 | 4 | 1 |
_3Table of contents only _uhttps://www.loc.gov/catdir/enhancements/fy1614/2015510566-t.html |
| 942 | _cEBK | ||
| 999 |
_c286352 _d286350 |
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