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Harman, George G.

Wire bonding in microelectronics / George G. Harmon - 3rd ed. - 1 online resource (xx, 426 p.) : illustrations (some color)

Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.

ISBN: 9780071476232

LCCN: 2010287045

Subjects--Topical Terms:
Encapsulado electrónico--Confiabilidad
Encapsulado electrónico--Defectos
Semiconductores--Defectos

Dewey Class. No.: 621.3815 / 23