Microvias :
Lau, John H.
Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee. - New York : McGraw-Hill, c2001. - 1 online resource (xxiii, 565 pages) : illustrations
The first-ever book on microvias, the new high-density interconnect technology changing the nature of printed circuit boards–and driving the mobile electronic revolution. A must for electronics and mechanical engineers, this intensive introduction covers microvia technology expertly surveys all major techniques: mechanical NC drilling, laser drilling, photo-defined, chemical etching, and conductive ink formation. Features a detailed survey of the work of leading companies–and their products–from around the globe.
9780071363273
Microelectronic packaging.
Integrated circuits--Design and construction--Cost control.
Semiconductors--Junctions.
Printed circuits.
621.381046
Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee. - New York : McGraw-Hill, c2001. - 1 online resource (xxiii, 565 pages) : illustrations
The first-ever book on microvias, the new high-density interconnect technology changing the nature of printed circuit boards–and driving the mobile electronic revolution. A must for electronics and mechanical engineers, this intensive introduction covers microvia technology expertly surveys all major techniques: mechanical NC drilling, laser drilling, photo-defined, chemical etching, and conductive ink formation. Features a detailed survey of the work of leading companies–and their products–from around the globe.
9780071363273
Microelectronic packaging.
Integrated circuits--Design and construction--Cost control.
Semiconductors--Junctions.
Printed circuits.
621.381046
