Through-silicon Vias for 3d Integration /
Lau, John H.
Through-silicon Vias for 3d Integration / John H. Lau. - 1 online resource (xxiv, 487 pages) : illustrations (some color)
Includes bibliographical references and index.
This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products.
9780071785143
Circuitos integrados tridimensionales
621.3815
Through-silicon Vias for 3d Integration / John H. Lau. - 1 online resource (xxiv, 487 pages) : illustrations (some color)
Includes bibliographical references and index.
This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products.
9780071785143
Circuitos integrados tridimensionales
621.3815
