Imagen de Amazon.com
Advanced MEMS packaging / John H. Lau ... [et al.]
Idioma: Inglés Editor: New York : McGraw-Hill, 2010Descripción: xxiii, 552 p. : ill. ; 24 cmTipo de contenido:- texto
- no mediado
- volumen
- 9780071626231 (alk. paper)
- 0071626239 (alk. paper)
- Advanced microelectromechanical systems packaging
- 621.381046 22
Contenidos:
Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices.
| Tipo de ítem | Biblioteca actual | Signatura | Estado | Fecha de vencimiento | Código de barras | Reserva de ítems |
|---|---|---|---|---|---|---|
E-Book
|
Sede Quito | 621.381046 (Navegar estantería(Abre debajo)) | Disponible | Ebook00346 |
Total de reservas: 0
Includes bibliographical references and index.
Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices.
No hay comentarios en este titulo.